The demand for small form factors for space-constrained embedded application is increasing rapidly. In response to this requirement, DFI gladly introduces you to ultra-small size products which includes industrial motherboards and system-on-modules based on the new generation Intel® Atom™ processor E3900 series (code name: Apollo Lake). Compared to the last generation Atom (N3700 Series), the brand new DFI product family supports harsh environments and narrow space operations with 30% higher performance and impressively optimized energy efficiency. These products are ideally designed for IoT, automation, transportation, and medical applications.

Rugged Design and Energy-Efficiency for Deeply Embedded Applications Based on Intel® Atom™ Processor E3900 Series

DFI launched new products to provide enhanced processing capability, low-power consumption, and brilliant graphic performance under Goldmont architecture with 14nm manufacturing node. Relying on DFI’s innovative abilities in design and manufacture, these products are small-sized, fanless, and support extended temperature range from -40°C up to +85°C, which makes it a perfect suite for many space-constrained and thermally limited embedded applications.

A wide array of rugged and reliable industrial motherboards and modules, including Mini-ITX, SBC, Pico-ITX, COM Express and Qseven R2.1 are now available with the new E3900 series processor from GSR Technology.